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MN101D10F , MN101D10G
Type ROM (x 8-bit) x RAM (x 8-bit) x Package Minimum Instruction Execution Time Interrupts
With main clock operated When sub-clock operated MN101D10F 96 K 2.5 K QFP100-P-1818B
*Lead-free
MN101D10G 128 K 3.5 K
0.1397 s (at 4.0 V to 5.5 V, 14.32 MHz) 71.5 s (at 2.7 V to 5.5 V fixed to 14.32 MHz internal frequency division) 61 s (at 2.5 V to 5.5 V, 32.768 kHz)
* RESET * Runaway * External 0 * External 1 * External 2 * External 3 * External 4 * Timer 0 * Timer 1 * Timer 2 * Timer 3 * Timer 6 * Capstan FG * Control * HSW * Cylinder(Drum) FG * Servo V-sync * Synchronous output * OSD * XDS * Serial 0 * Serial 1 * Serial 2 * PWM 4 * OSDV-sync Timer counter 0: 8-bit x 1 (timer function) Clock source ********************* 1/4, 1/16 of system clock frequency Interrupt source ***************** overflow of timer counter 0 Timer counter 1: 8-bit x 1 (timer function, linear timer counter function) Clock source ********************* 1/4 of system clock frequency; CTL signal Interrupt source ***************** overflow of timer counter 1 Timer counter 2: 16-bit x 1 (timer function, input capture,duty judgment of CTL signal(VISS/VASS detection function), generation of remote control output carrier frequency) Clock source ********************* 1/4, 1/16, 1/24 of system clock frequency Interrupt source ***************** overflow of timer counter 2; input of CTL specified edge; underflow of timer 2 shift register 4-bit counter; coincidence of timer 2 shift register with timer 2 shift register compare register Timer counter 3: 16-bit x 1 (timer function, generation of serial transmission clock) Clock source ********************* 1/4, 1/16 of system clock frequency Interrupt source ***************** overflow of timer counter 3 Timer counter 5: 19-bit x 1 (watchdog, stable oscillation waiting function) Clock source ********************* system clock Watchdog interrupt source *** 1/2 16, 1/219 of timer counter 5 frequency Clear by stable oscillation *** after 256 counts by timer counter 5 (2 18 counts of OSC oscillation clock) Timer counter 6: 16-bit x 1 (clock function [max. 2 s]) Clock source ********************* 1/512 of OSC oscillation clock frequency; XI oscillation clock; 1/8, 1/128 of system clock frequency Interrupt source ***************** 1/213, 1/2 14, 1/215 overflow of timer counter 6 Serial 0: 8-bit x 1 (synchronous type) (transfer direction of MSB/LSB selectable, start condition function) Clock source ********************* 1/8, 1/16, 1/32, 1/64, 1/128, 1/256 of system clock frequency; NSBT0 pin input Serial 1: 8-bit x 1 (synchronous type/remote control transmission) (transfer direction of MSB/LSB selectable, start condition function) Clock source ********************* 1/8, 1/16, 1/32, 1/64, 1/128, 1/256 of system clock frequency; 2-division timer 3 output; NSBT1 pin input Remote control clock ******* 2-division timer 3 output Serial 2: 8-bit x 1 (I 2C) (master transmission/reception, slave transmission/reception) Clock source ********************* 1/144 to 1/252 of system clock; SCK pin input
Timer Counter
Serial Interface
MAD00043BEM
MN101D10F, MN101D10G
OSD
Display mode Applicable broadcasting system Screen configuration Character type Character size Enlarged characters Character interpolation Line background color Line background intensity Screen background color : Character color Character intensity Border function Border brightness Blinking Inverted character Halftone Input Clamp method Output Measure against image fluctuation Dot clock MESECAM compatibility
: : : : : : : : : : : : : : : : : : : : : : :
menu(intermal synchronized) display, superimpose(externally synchronized) display NTSC, PAL, PAL-M, PAL-N 24 characters x 2n rows (n = 1 to 6) max. 256 character types (variable, include special characters) 12 x 18 dots (vertical direction: 1 dot for 2H at not enlargement) each x 2 settings in horizontal and vertical none 8-hue settable in the row unit at menu display 8 gradations settable in the row unit 8-huesettable at menu display white 8 gradations settable in the row unit 1-dot border in 8 directions 4 gradations settable in the row unit none (covered by software) settable in the character unit none composite video signal input (output level: 1 V[p-p] / 2 V[p-p]) sync tip clamp, clamp level in 4 levels composite video output built-in AFC circuit 1/2 of OSC oscillation clock (automatic phase adjustment) Subcarrier leak function for superimpose display
XDS ROM Correction I/O Pins A/D Inputs PWM ICR OCR Special Ports Notes I/O Input
Built-in U.S. closed caption data slicer (optional 1 line data can be extracted.) Correcting address designation: up to 3 addresses possible Correction method: correction program being saved in internal RAM 76 1 * Common use: 56 * Common use: 1
8-bit x 12-ch. (without S/H) 13-bit x 2-ch. (at repetition cycle 572 s at 14.32 MHz), 8-bit x 1-ch. (at repetition cycle 35.7 s, 0.572 ms, 1.14 ms, 2.29 ms at 14.32 MHz) 16-bit x 2-ch.(Speed system), 18-bit x 4-ch.(Phase system) 16-bit x 3 (Synchronous output x 2, Rec CTL x 1 ) 3-state output (PTO) VLP pin; CTL input;Capstan FG input; Cylinder(Drum) PG/FG inputs; HSW output; Head amp/ Rotary outputs; built-in FG amp; output of 1/4 OSC oscillation clock (1 V[p-p])
See the next page for electrical characteristics, pin assignment and support tool.
MAD00043BEM
Electrical Characteristics
Supply current
Limit Parameter Symbol IDD1 Operating supply current IDD2 IDD3 32 kHz oscillation operation without load Supply current at STOP IDSP IDHT0 Supply current at HALT IDHT1 32 kHz oscillation operation without load Stop of oscillation without load, VDD = 5 V, Ta = 55 C 14.32 MHz oscillation without load, VDD = 5 V Stop of 14.32 MHz oscillation, VDD = 2.7 V 5 20 5 10 15 A mA A Condition min 14.32 MHz operation without load, VDD = 5 V 1/1024 of 14.32 MHz operation without load, VDD = 2.7 V Stop of 14.32 MHz oscillation, VDD = 2.7 V 50 100 typ 50 2 max 100 5 mA mA A Unit
(Ta = 25 C 2 C , VSS = 0 V)
A/D Converter Performance
Limit Parameter Conversion relative error A/D Conversion Time Analog Input Voltage Symbol NLAD tAD fosc = 14.32 MHz 8 5 Condition min typ max 3 LSB s V Unit
(Ta = 25 C 2 C , VDD = 5.0 V, VSS = 0 V)
MAD00043BEM
MN101D10F, MN101D10G
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
RCTLN RCTLP AVDD CTLA AVSS VRI VRO AFG FGF YPG(P91) YFG(PFG) P92 PA0 PA1 PA2 PA3 PA4 PA5 PA6 SECAM(PA7) FSCLPF(PB0) FSCI(PB1) AFCLPF(PB2 AFCC(PB3) VDD2
Pin Assignment
Support Tool
In-circuit Emulator Flash Memory Built-in Type
PX-ICE101C / D + PX-PRB101D10-QFP100-P-1818B-CN-M Type ROM (x 8-bit) RAM (x 8-bit) Minimum instruction execution time MN101DF10GAF 128 K 4K 0.1397 s (at 4.0 V to 5.5 V, 14.32 MHz) 71.5 s (at 2.7 V to 5.5 V, fixed to 14.32 MHz internal division) 61 s (at 2.5 V to 5.5 V, 32.768 kHz) Package QFP100-P-1818B *Lead-free
MAD00043BEM
IRQ0(P64) IRQ1(P63) IRQ2(P62) IRQ3(P61) IRQ4(P60) P54 P53 P52 P51 NSDO(P50) NSBT1(P07) NSBI1(P06) NSBO1(P05) NSBT0(P02) NSBI0(P01) NSBO0(P00) SDA(P27) SCK(P26) HBUFD6(P46) HBUFD4(P44) HBUFD2(P42) HBUFD0(P40) HSW VLP NRST(P04)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
CO P90 AD11(PC3) AD10(PC2) AD9(PC1) AD8(PC0) AD7(P87) AD6(P86) AD5(P85) AD4(P84) AD3(P83) AD2(P82) AD1(P81) AD0(P80) P77 P76 P75 P74 P73 P72 P71 P70 ROTA(P67) HAMP(P66) DENV(P65)
76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
MN101D10G MN101D10F
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26
CVIN2(PB4) CVIN(PB5) VSS2 CVOUT(PB6) PB7 P20 P21 P22 SXI XO(P23) XI(P24) VSS OSCI OSCO VDD SBUFD0(P25/PWM4) PWM0 PWM1 SBUFD1(P11) SBUFD2(P12) SBUFD3(P13) SBUFD4(P14/TC6O) SBUFD5(P15) SBUFD6(OSDH/P16/XDSCK) SBUFD7(OSDV/P17/OSCDIV/XDSDAT
QFP100-P-1818B
*Lead-free
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP

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